Article "On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers"

Posted on: 19 June 2020
By: Admin

An article dedicated to Silense project: Roshanghias, A., Dreissigacker, M., Scherf, C., Bretthauer, C., Rauter, L., Zikulnig, J., Braun, T., Becker, K.F., Rzepka, S. and Schneider-Ramelow, M., 2020. On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers. Micromachines, 11(6), p.564. https://www.mdpi.com/2072-666X/11/6/564/pdf